​Global Underfill Market Analysis & Forecast Report 2017-2022

Global Underfill Market Analysis & Forecast Report 2017-2022

The Underfill market research report analyzes global adoption trends, future growth potentials, key drivers, competitive outlook, restraints, opportunities, key challenges, market ecosystem, and value chain analysis.

This report presents a detailed analysis, market sizing, and forecasting for the emerging subsegments within the Underfill market. The report is thoroughly segmented by product type, application, vertical, and region.

The report also focuses on various regional markets for each of the subsegments within the Underfill market. The major regions include North America, Europe, APAC, MEA, and Latin America. APAC is expected to hold the largest market share in 2016 with 39.8%, and China is in the growth phase and is the fastest-growing region for the global Underfill market.

The primary vendors in the Underfill market include Henkel, WON CHEMICAL, Namics, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond etc. This research report studies the strategic alliances and lucrative acquisitions between various global and local players in the Underfill ecosystem. The players have majorly adopted the strategy of new product launches to enhance their business in the Underfill market. Vendors are launching new products so as to cater to the need of diverse end users in different geographic regions.

In the past few years from 2011-2015, global underfill industry developed fast with a 10%~30% growth rate, which is mostly driven by emerging countries, like China, India, Brazil. The Underfill market is expected to grow from USD 368 million in 2016 to USD 475 million by 2022, at a CAGR of 4.35%.

In terms of manufacturers, Henkel, WON CHEMICAL, NAMICS captured the top three revenue share spots in the underfill market in 2016. Henkel dominated with 29 percent revenue share, followed by WON CHEMICAL with 13.85 percent revenue share and NAMICS with 6.46 percent revenue share.

Report link: http://www.chlueresearch.com/product/global-underfill-market-analysis-forecast-report-2017-2022/

Frequency, Time Period
2012– 2017 base years
5-year annual forecast (2018 – 2022)

Region and Country Coverage:
Europe; UK, France, Germany, Italy, Spain, Netherlands, Belgium, Switzerland, Austria, Portugal, Denmark, Finland, Norway, Sweden, Ireland, Russia, Turkey, Poland, Western Europe, Central and Eastern Europe
North America: USA, Canada
Asia Pacific: Japan, China, South Korea, Australia, New Zealand

Underfill Market Segment by Product:
1. Semiconductor Underfills
2. Board Level Underfills

Underfill Market Segment by Application:
1. Defense & Aerospace Electronics
2. Consumer Electronics (laptops, mobile phones, MP3 players, game consoles, digital cameras,etc.)
3. Automotive Electronics
4. Medical Electronics

Key Issues Addressed
1. Competitive Landscape and Strategic Recommendations
2. The market forecast and growth areas for Underfill Market
3. Changing Market Trends and Emerging OpportUnities
4. Historical shipment and revenue
5. Analysis key applications
6. Main manufacturers market share

Customization
We can offer customization in the report without any extra charges and get research data or trends added in the report as per the buyer’s specific needs.

Contact Us
+86-185-5010-7281
sales@chlueresearch.com